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Analysis of the resistance of adhesive joints

Analysis of the resistance of adhesive joints

Adhesive technology

Bonding is the joining technology of the present and the future. Countless everyday products are now only produced using adhesive bonding technology. Our interdisciplinary team has a lot of experience with the analysis of bonded joints and offers – depending on your requirements – the appropriate test design for the characterization and testing of adhesives, bonded parts and surfaces.

At the OFI, all relevant parameters of bonded joints are tested, including the characterization of adhesives, bonded parts and surfaces as well as their pretreatment. In addition to the concrete testing of bonded joints, the durability of bonded joints is analyzed at the OFI. In addition, we offer damage analyses and carry out mechanical tests as well as assessments of energetic surfaces. We can consider the surface pretreatment and its characterization in the individual test design, depending on the specific issue.

OFI is also an accredited certification body for DIN 6701 “Bonding in rail vehicle construction” and DIN 2304 “Quality requirements of bonding processes” in industry and trade.


Our tests

  • Assessment of the chemical-physical composition
    • Adhesive base
    • Primer
    • Fillers
    • Trace analysis for impurities (adhesion-releasing substances)
    • Checking the curing process
    • Substance migration
    • Solvent composition
    • Trace analysis for additives (e.g. plasticizers, biocides, stabilizers, etc.)
    • Thermal analysis, e.g. low-temperature embrittlement and glass temperature, softening temperature, temperature resistance, thermal elasticity behavior
    • Assessment of degree of cure, curing and setting behavior, residual monomer and residual solvent content
    • Mixing ratios of multicomponent systems and resin-hardener systems
    • Molecular weight determination and determination of the degree of crosslinking
    • Acid number, degree of saturation/double bond number, ester and OH number
  • Design (calculation) and testing of bonded joints
  • Selection and optimization of adhesives
  • Resistance of bonded joints
    • Against artificial weathering (e.g. EN ISO 4892-2/3, EN ISO 16474-1/3, EN ISO 11341, DIN 75220 (“sun simulation”)) and aging as well as outdoor weathering
    • Against corrosive influences such as humidity (e.g. EN ISO 6270-1/2), salt (e.g. EN ISO 9227), harmful gases, climate change tests
    • Media resistance, diffusion and migration tests
    • Determination of the thermoanalytical parameters
      • thermogravimetric analysis (TGA)
      • dynamic differential calorimetry (DDK; DSC)
      • thermomechanical analysis (TMA)
      • dynamic mechanical analysis (DMA, DMTA)
  • Determination and measurement of complex adhesive joints
  • Damage Analysis
  • Mechanical tests in the temperature range -40°C to +250°C:
    • Hardness testers according to Shore A and B, micro-IRHD, ball indentation hardness, Barcoll-, Brinell- and Rockwell hardness
    • Vickers-HDT Heat resistance test
    • Tensile, compression, bending test
    • Puncture and tear tests
    • Peeling tests (roller peeling test, 90°/180° peeling test, climbing drum)
    • Impact bending, impact tensile test
    • Shear (thrust) test
    • Vibration tests
    • Tear test (dynamic modulus, fatigue)
    • Creep and relaxation test
    • Alternating load, threshold load, Wöhler curve (up to 20 Hz, up to 10 kN, displacement ±6 mm)Rheology
  • Non-destructive testing: 3D layer build-up testing by ultrasonic microscopy, defect and delamination testing by active theromgraphy (electrical, magnetic-inductive and ultrasonic excitation), chemiluminescence
  • Assessment, testing and modification of energetic surface properties: surface energy determination, wettability, surface activation (e.g. free-jet corona, flame treatment)
  • Surface pretreatment mechanical/chemical/physical and their characterization
  • Rheology
  • Material compatibilities and interactions between adhesives and joined parts
  • Topographic analysis and photo documentation using high-resolution light microscopy, FTIR and Raman microscopy, scanning electron microscopy.
  • Training courses (basic and advanced training of bonding specialists)

OFI Adhesive Expert

Ing. Martin Tonnhofer
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